http://www.masterbond.com/mbspotlight/ep21fl/mbspotlight-ep21fl.html

Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to +250ºF.

The hardened compound is an electrical insulator with a volume resistivity greater than 10¹² ohm-cm. As a flexibilized system, it is characterized by superior impact and chemical resistance.

EP21FL is available in half pint, pint, quart, one gallon and five gallon container kits.